Featuring 8.9 million pixels, sub-micron resolution, and a data rate of 110 gigapixels per second, the DLP991UUV eliminates costly mask technology while enabling scalable, precise, and cost-effective manufacturing for advanced semiconductor packaging.
Why it matters
Maskless digital lithography — which projects light directly to etch circuit designs without photomasks — is rapidly transforming advanced packaging.
By combining multiple chips and technologies into one package, manufacturers can deliver smaller, faster, and more power-efficient systems that power data centers, 5G, and AI applications.
TI’s DLP991UUV acts as a programmable photomask, giving equipment makers the pixel-level precision and speed required to scale high-resolution printing for next-gen packaging.
“Just as we redefined cinema with digital projection, TI’s DLP technology is once again at the forefront of a major industry shift,” said Jeff Marsh, vice president and general manager of DLP technology at TI.
More details
By eliminating physical masks, TI’s DLP technology reduces infrastructure costs and allows real-time design flexibility.
Sub-micron precision on substrates of any size boosts throughput, yield, and reliability, giving manufacturers the edge in meeting rising demand for high-bandwidth, low-power components.
Key specs of the DLP991UUV:
This launch cements TI’s role in industries spanning from cinema projection and automotive lighting to precision lithography and machine vision.
Availability
Preproduction quantities of the DLP991UUV are available now on TI.com, with multiple payment and shipping options. —Ed: Corrie S. Narisma
